Electronic apparatus including light source unit and method of fabricating the same

ABSTRACT

A light source unit includes a plate including a front surface and a rear surface opposite to the front surface, a light scattering section on the front surface of the plate, a light controlling section on the light scattering section and including a plurality of quantum dots, a light source on the rear surface of the plate and including a light emitting element which generates light, a light emitting surface from which the light is emitted, and a plurality of lead frames connected to the light emitting element. The light source provides light from the rear surface of the plate toward the light controlling section. The light emitting surface of the light source is in contact with the rear surface of the plate.

This application claims priority to Korean Patent Application No.10-2019-0085746, filed on Jul. 16, 2019, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field

Embodiments of the invention relate to an electronic apparatus includinga light source unit and a method of fabricating the electronicapparatus, and more particularly, to a small-sized electronic apparatusand a method of fabricating the small-sized electronic apparatus.

2. Description of the Related Art

Various types of electronic apparatus have been used to display imageinformation, and a liquid crystal display device is being widely usedfor large-sized display devices, portable display devices, etc., due todesired characteristics thereof, such as low power consumption. In sucha liquid crystal display device, various kinds of optical members areincluded to a light source unit thereof to increase an opticalefficiency and color reproduction properties.

SUMMARY

Recently, an electronic apparatus having small thickness and highoptical characteristics is increasingly demanded, but when variousoptical members are included therein to improve display quality, thetotal thickness of the display device may be increased.

Embodiments of the invention provide an electronic apparatus having asmall size or thickness with improved optical characteristics.

According to an embodiment of the invention, a light source unitincludes: a plate including a front surface and a rear surface oppositeto the front surface; a light scattering section on the front surface ofthe plate; a light controlling section on the light scattering section,where the light controlling section includes a plurality of quantumdots; a light source on the rear surface of the plate, where the lightsource includes a light emitting element which generates light, a lightemitting surface from which the light is emitted, and a plurality oflead frames connected to the light emitting element. In such anembodiment, the light source provides light from the rear surface of theplate toward the light controlling section, and the light emittingsurface of the light source is in contact with the rear surface of theplate.

In an embodiment, the plate may include: a base layer including a topsurface, on which the light scattering section is disposed, and a bottomsurface opposite to the top surface; a plurality of conductive lines onthe bottom surface of the base layer; and a window dielectric layerwhich covers the bottom surface of the base layer, where a plurality ofcontact holes may be defined through the window dielectric layer toexpose portions of the conductive lines. In such an embodiment, each ofthe lead frames may be connected to a corresponding one of theconductive lines.

In an embodiment, the light source unit may further comprise a pluralityof conductive pastes on the window dielectric layer, where theconductive pastes may overlap the contact holes, respectively. In suchan embodiment, the lead frames may be connected to the conductive linesthrough the conductive pastes.

In an embodiment, the base layer may include a line groove patterned onthe bottom surface of the base layer in a thickness direction of theplate. In such an embodiment, the conductive lines may be disposed inthe line groove.

In an embodiment, the light source may be provided in plural. In such anembodiment, the light scattering section may include a plurality ofscattering patterns which overlaps the plurality of light sources,respectively, when viewed in a plan view. In such an embodiment, thelight controlling section may further include a plurality of controllingpatterns which overlaps the scattering patterns, respectively, whenviewed in the plan view.

In an embodiment, a width of each of the controlling patterns may begreater than a maximum width of light irradiated to the front surface ofthe plate from a corresponding one of the light sources.

In an embodiment, the light provided from the light source toward thelight controlling section may be a blue light.

In an embodiment, the quantum dots of the light controlling section mayconvert the light provided from the light source into one of a red lightand a green light. In such an embodiment, the light source unit mayfurther include a light reflecting section spaced apart from the rearsurface of the plate over the light source.

According to an embodiment of the invention, an electronic apparatusincludes: a light source unit; a display unit on the light source unit;and an optical sheet between the display unit and the light source unit.In such an embodiment, the light source unit includes a plate includinga front surface and a rear surface opposite to the front surface, alight scattering section on the front surface of the plate, a lightcontrolling section on the light scattering section, and a light sourceon the rear surface of the plate, where the light controlling sectionincludes a plurality of quantum dots, and the display unit includes afirst substrate, a second substrate opposite to the first substrate, anda liquid crystal layer between the first substrate and the secondsubstrate. In such an embodiment, the light source provides the displayunit with light and contacts the rear surface of the plate.

In an embodiment, the plate may include: a base layer including a topsurface, on which the light scattering section is disposed, and a bottomsurface opposite to the top surface; a plurality of conductive lines onthe bottom surface of the base layer; and a window dielectric layerwhich covers the bottom surface of the base layer, where a plurality ofcontact holes may be defined through the window dielectric layer toexpose portions of the conductive lines.

In an embodiment, the light source may include a light emitting elementwhich generates light and a plurality of lead frames connected to thelight emitting element. In such an embodiment, each of the lead framesmay be connected to a corresponding one of the conductive lines.

In an embodiment, the light source unit may further include a pluralityof conductive pastes on the window dielectric layer, where theconductive pastes may overlap the contact holes. In such an embodiment,the lead frames may be connected to the conductive lines through theconductive pastes.

In an embodiment, the base layer may include a line groove patterned onthe bottom surface of the base layer in a thickness direction of theplate. In such an embodiment, the conductive lines may be disposed inthe line groove.

In an embodiment, the light source may be provided in plural. In such anembodiment, the light scattering section may include a plurality ofscattering patterns which overlaps the plurality of light sources,respectively, when viewed in a plan view, and the light controllingsection may further include a plurality of controlling patterns whichoverlaps the scattering patterns, respectively, when viewed in the planview.

In an embodiment, a width of each of the controlling patterns may begreater than a maximum width of light irradiated to the front surface ofthe plate from a corresponding one of the light sources.

In an embodiment, the first substrate may include a first basesubstrate, a transistor on the first base substrate, a first electrodeconnected to the transistor, a color filter layer between the transistorand the first electrode, and a first polarizing layer below the firstbase substrate. In such an embodiment, the second substrate may includea second base substrate, a second electrode on the second basesubstrate, and a second polarizing layer on the second base substrate.

In an embodiment, the optical sheet may include at least one sheetselected from a diffusion sheet, a prism sheet, and a brightnessenhancement sheet.

According to an embodiment of the invention, a method of fabricating alight source unit includes: providing a preliminary plate which includesa base layer including a top surface and a bottom surface opposite toeach other, a light scattering section on the top surface of the baselayer, and a light controlling section on the light scattering section;patterning the bottom surface of the base layer to form a line groove,where the bottom surface is patterned in a thickness direction of thebase layer; providing a plurality of conductive lines in the linegroove; providing a window dielectric layer on the conductive lines andforming a plurality of contact holes through the window dielectric layerto expose at least portions of the conductive lines; providing aplurality of conductive pastes which overlaps the contact holes,respectively; and providing a light source connected to the conductivelines through the conductive pastes. In such an embodiment, the lightsource is in contact with the window dielectric layer.

In an embodiment, the method may further include: heating the conductivepastes; and solidifying the conductive pastes which are in a moltenstate.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the invention will become more apparentby describing in detail exemplary embodiments thereof with reference tothe accompanying drawings, in which:

FIG. 1 illustrates an exploded perspective view showing an electronicapparatus according to an exemplary embodiment of the invention;

FIG. 2 illustrates a cross-sectional view showing a display unitaccording to an exemplary embodiment of the invention;

FIG. 3 illustrates a cross-sectional view showing a light source unitaccording to an exemplary embodiment of the invention;

FIG. 4A illustrates a plan view showing a light source unit according toan exemplary embodiment of the invention;

FIG. 4B illustrates an enlarged plan view showing a light source unitaccording to an exemplary embodiment of the invention;

FIG. 4C illustrates a cross-sectional view taken along line I-I′ of FIG.4B;

FIG. 5A illustrates a plan view showing a light source unit according toan exemplary embodiment of the invention;

FIG. 5B illustrates a cross-sectional view taken along line II-IF ofFIG. 5A;

FIG. 6 illustrates a cross-sectional view showing a light source unitaccording to an exemplary embodiment of the invention;

FIG. 7 illustrates a cross-sectional view showing a light source unitaccording to an exemplary embodiment of the invention; and

FIGS. 8A to 81 illustrate cross-sectional views showing a method offabricating an electronic apparatus according to an exemplary embodimentof the invention.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. Like reference numerals refer tolike elements throughout.

In this description, when a certain component (or region, layer,portion, etc.) is referred to as being “on”, “connected to”, or “coupledto” other component(s), the certain component may be directly disposedon, directly connected to, or directly coupled to the other component(s)or at least one intervening component may be present therebetween. Incontrast, when an element is referred to as being “directly on”,“directly connected to”, or “directly coupled to” another element, thereare no intervening elements present.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

In addition, the terms “beneath”, “lower”, “above”, “upper”, and thelike are used herein for ease of description to describe one element orfeature's relationship to another element(s) or feature(s) asillustrated in the figures. It will be understood that the spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,elements described as “below” or “beneath” other elements or featureswould then be oriented “above” the other elements or features. Thus, theexemplary term “below” can encompass both an orientation of above andbelow. The device may be otherwise oriented (rotated 90 degrees or atother orientations) and the spatially relative descriptors used hereininterpreted accordingly.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms used herein including technical andscientific terms have the same meaning generally understood by one ofordinary skilled in the art. Also, terms as defined in dictionariesgenerally used should be understood as having meaning identical ormeaning contextually defined in the art and should not be understood asideally or excessively formal meaning unless definitely defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 illustrates an exploded perspective view showing an electronicapparatus according to an exemplary embodiment of the invention. FIG. 2illustrates a cross-sectional view showing a display unit according toan exemplary embodiment of the invention. FIG. 3 illustrates across-sectional view showing a light source unit according to anexemplary embodiment of the invention.

Referring to FIG. 1, an exemplary embodiment of an electronic apparatusEA includes a window member WM, a display unit DP, an optical sheet OP,a light source unit LU, and an accommodation member HWM. The electronicapparatus EA may include a display device, which provides an image. Inone exemplary embodiment, for example, the electronic apparatus EA maybe a liquid crystal display device or an organic electroluminescencedisplay device.

In the drawings, first, second and third directional axes DR1, DR2 andDR3, which are relative concepts, are illustrated, and the thirddirectional axis DR3 may be defined to indicate a direction along whichan image is provided to users. In the drawings, the first directionalaxis DR1 (also referred to herein as a first direction) and the seconddirectional axis DR2 (also referred to herein as a second direction) maybe perpendicular to each other, and the third directional axis DR3 (alsoreferred to herein as a third direction) may be a normal direction to aplane defined by the first direction DR1 and the second direction DR2.In FIG. 1, a plane defined by the first direction DR1 and the seconddirection DR2 may be a display surface on which an image is provided,and the third direction DR3 may be a thickness direction of the displayunit DP.

The window member WM is disposed on the display unit DP. The windowmember WM may include or be formed of a material including a glass,sapphire, or a plastic. The window member WM includes a lighttransmitting area TA through which an image from the display unit DP isdisplayed and a light shielding area BZA through which no image isdisplayed.

When viewed from a plan view in the third direction DR3, the lighttransmitting area TA may be disposed on a central portion of theelectronic apparatus EA. The light shielding area BZA may be disposedaround the light transmitting area TA and may have a frame shape thatsurrounds the light transmitting area TA. The invention, however, arenot limited thereto. In an alternative exemplary embodiment, the windowmember WM may include only the light transmitting area TA, and in suchan embodiment, the light shielding area BZA may be omitted.Alternatively, the light shielding area BZA may be disposed on at leastone side of the light transmitting area TA. Alternatively, the windowmember WM may be omitted from the electronic apparatus EA.

Referring to FIG. 2, an exemplary embodiment of the display unit DP mayinclude a first substrate SUB1, a second substrate SUB2, and a liquidcrystal layer LC. The liquid crystal layer LC is disposed between thefirst substrate SUB1 and the second substrate SUB2.

The first substrate SUB1 may include a first base substrate BS1, atransistor TFT, a planarization layer OC, a color filter layer CF, afirst electrode PE, a plurality of dielectric layers IL1 and IL2, and afirst polarizing layer POL1.

The second substrate SUB2 may include a second base substrate BS2, asecond electrode CE, and a second polarizing layer POL2.

The first base substrate BS1 may be provided as a base layer on whichcomponents of the first substrate SUB1 are dispose or formed, e.g.,deposited and/or patterned. Each of the first and second base substratesBS1 and BS2 may be a transparent dielectric substrate. In one exemplaryembodiment, for example, each of the first and second base substratesBS1 and BS2 may be a glass substrate or a plastic substrate.Alternatively, each of the first and second base substrates BS1 and BS2may be a metal substrate, but the invention is not limited thereto. Thefirst and second base substrates BS1 and BS2 may be disposed opposite toeach other.

The display unit DP includes a pixel that displays an image. The pixelmay be provided in plural, and the plurality of pixels may be arrangedin a matrix shape on a plane defined by the first direction DR1 and thesecond direction DR2.

The pixel is disposed between the first base substrate BS1 and thesecond base substrate BS2. The pixel includes the transistor TFT and aliquid crystal capacitor PE, LC, and CE. The transistor TFT includes acontrol electrode GE, an input electrode SE, an output electrode DE, anda semiconductor pattern SM. The liquid crystal capacitor PE, LC, and CEincludes the first electrode PE connected to the transistor TFT, thesecond electrode CE opposite to the first electrode PE, and a dielectriclayer between the first electrode PE and the second electrode CE. In anexemplary embodiment, the dielectric layer corresponds to the liquidcrystal layer LC.

Each of the pixels is connected to corresponding signal lines of aplurality of signal lines. The signal lines include a plurality of gatelines and a plurality of data lines. The plurality of gate lines arearranged in one direction on the display unit DP. The plurality of datalines are insulated from and intersect the plurality of gate lines.

The control electrode GE is disposed on the first base substrate BS1.The control electrode GE may be branched from the gate line. The controlelectrode GE includes a conductive material. In one exemplaryembodiment, for example, the control electrode GE may include at leastone selected from a metal oxide and a metal, such as nickel (Ni),molybdenum (Mo), aluminum (Al), titanium (Ti), copper (Cu), and tungsten(W). The control electrode GE have a single layer structure or amulti-layer structure. The gate line include or is formed of a samematerial as and has a same layered structure as those of the controlelectrode GE.

The first dielectric layer IL1 covers the control electrode GE and thefirst base substrate BS1. The first dielectric layer IL1 may include aninorganic material. In one exemplary embodiment, for example, the firstdielectric layer IL1 may include at least one material selected fromsilicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride(SiON).

The semiconductor pattern SM is disposed on the first dielectric layerIL1. At least a portion of the semiconductor pattern SM overlaps thecontrol electrode GE.

FIG. 2 shows an exemplary embodiment where the transistor TFT is abottom gate type transistor, but the invention is not limited thereto.In one alternative exemplary embodiment, for example, the transistor TFTmay be a top gate type transistor, in which a control electrode isdisposed on input and output electrodes, but not being limited thereto.

The input electrode SE and the output electrode DE are disposed on thefirst dielectric layer IL1. One side of the input electrode SE isconnected to a corresponding data line, and other side of the inputelectrode SE overlaps the semiconductor pattern SM. One side of theoutput electrode DE overlaps the semiconductor pattern SM, and otherside of the output electrode DE is connected to the second electrode CE.The other side of the input electrode SE and the one side of the outputelectrode DE are spaced apart from each other.

Each of the input and output electrodes SE and DE includes a conductivematerial. In one exemplary embodiment, for example, each of the inputand output electrodes SE and DE may include at least one materialselected from nickel (Ni), chromium (Cr), molybdenum (Mo), aluminum(Al), titanium (Ti), copper (Cu), tungsten (W), and a combination (e.g.,an alloy) thereof. Each of the input and output electrodes SE and DE mayhave a single layer structure or a multi-layer structure. The data lineincludes or is formed of a same material as and has a same layeredstructure as those of the input electrode SE.

The second dielectric layer IL2 is disposed on the first dielectriclayer IL1. The second dielectric layer IL2 covers the input and outputelectrodes SE and DE. The second dielectric layer IL2 may include a samematerial as that of the first dielectric layer IL1.

The planarization layer OC is disposed on the transistor TFT. Theplanarization layer OC is disposed on an inorganic layer placed on thetransistor TFT and provides a planar top surface. The planarizationlayer OC may include an organic material.

The color filter layer CF may be disposed on the planarization layer OC.The color filter layer CF may include three or more filters, each ofwhich transmits light of a wavelength range different from that of lightthat passes through other one of the filters. In one exemplaryembodiment, for example, the color filter layer CF may include a redcolor filter, a green color filter, and a blue color filter, andoptionally a white color filter, but the invention is not limitedthereto. The filters, which transmit light having different wavelengthranges from each other, included in the color filter layer CF may bearranged in various orders or patterns.

Although not shown, a capping layer may be disposed on the color filterlayer CF. The capping layer may include an inorganic material. In oneexemplary embodiment, for example, the capping layer may include siliconnitride or silicon oxide.

FIG. 2 shows an exemplary embodiment having a color-filter-on-array(“COA”) structure in which the display unit DP is provided or formed ona single substrate, on which the transistor TFT and the color filterlayer CF are provided or formed. The invention, however, are not limitedthereto. Alternatively, the display unit DP may be configured in a waysuch that the transistor TFT is included in the first substrate SUB1 andthe color filter layer CF is included in the second substrate SUB2, butnot being limited thereto.

The second electrode CE is disposed on the color filter layer CF. Thesecond electrode CE is electrically connected to the output electrode DEthrough a contact hole defined through the color filter layer CF and theplanarization layer OC. The second electrode CE is electricallyconnected to the output electrode DE and thereby receives voltage thatcorresponds to a data signal.

The second electrode CE may include a transparent conductive material.In one exemplary embodiment, for example, the second electrode CE mayinclude a least one material selected from indium tin oxide, indium zincoxide, indium gallium zinc oxide, fluorine zinc oxide, gallium zincoxide, and tin oxide.

The first polarizing layer POL1 is disposed below the first basesubstrate BS1. The first polarizing layer POL1 is a coated polarizinglayer, a polarizing layer formed by deposition, or is formed by coatinga dichromatic dye and a liquid crystal compound. Alternatively, thefirst polarizing layer POL1 may be a wire grid type polarizing layer.

Although FIG. 2 shows an exemplary embodiment where the first polarizinglayer POL1 is disposed below the first base substrate BS1, but not beinglimited thereto. Alternatively, the first polarizing layer POL1 may bean in-cell type polarizing layer disposed between the first basesubstrate BS1 and the liquid crystal layer LC, but the invention is notlimited thereto.

The liquid crystal layer LC includes liquid crystal molecules havingdirectionality. An arrangement of the liquid crystal molecules arechanged in accordance with an electric field generated based on adifference in voltage between the first electrode PE and the secondelectrode CE. An amount of light that passes through the liquid crystallayer LC may be determined based on the arrangement of the liquidcrystal molecules.

Although not shown, the display unit DP may further include a pluralityof alignment layers disposed on and below the liquid crystal layer LC.One of the alignment layers is disposed between the liquid crystal layerLC and the first electrode PE and other one of the alignment layers isdisposed between the liquid crystal layer LC and the second electrodeCE, which results in orientation of the liquid crystal molecules. Thealignment layers may include or be formed of vertical alignment layersand may include at least one material selected from polyamic acid,polysiloxane acid, polyimide, for example.

The second electrode CE is disposed on the liquid crystal layer LC. Insuch an embodiment, as described above, the second electrode CE, theliquid crystal layer LC, and the second electrode CE constitute theliquid crystal capacitor.

The second electrode CE may include a transparent conductive material.In one exemplary embodiment, for example, the second electrode CE mayinclude at least one material selected from indium tin oxide, indiumzinc oxide, indium gallium zinc oxide, fluorine zinc oxide, gallium zincoxide, and tin oxide.

The second polarizing layer POL2 is disposed on the second basesubstrate BS2. The second polarizing layer POL2 may be a coatedpolarizing layer or a polarizing layer formed by deposition.Alternatively, the second polarizing layer POL2 may be a film typepolarizing member that is separately fabricated and provided on thesecond base substrate BS2.

Although FIG. 2 shows an exemplary embodiment where the secondpolarizing layer POL2 is disposed on the second base substrate BS2, butnot being limited thereto. Alternatively, the display unit DP may beconfigured in a way such that the second polarizing layer POL2 is anin-cell type polarizing layer disposed below the second base substrateBS2.

Referring back to FIG. 1, the optical sheet OP is disposed between thedisplay unit DP and the light source unit LU. The optical sheet OP mayserve to reduce loss of light and to increase brightness of light whenthe light from the light source unit LU passes therethrough to thedisplay unit DP. The optical sheet OP may include at least one sheetselected from a diffusion sheet (not shown), a prism sheet PR, and abrightness enhancement sheet DB.

The brightness enhancement sheet DB, such as a dual brightnessenhancement film (“DBEF”) commercially available from 3M Company, servesto reduce loss of light provided from the light source unit LU. Theprism sheet PR serves to change side light into front light with respectto light that has passed through the brightness enhancement sheet DB andthereby to concentrate radiating light, which results in an increase inbrightness.

Referring to FIG. 3, in an exemplary embodiment, the light source unitLU includes a plate GL, a light scattering section (or layer) FL, alight controlling section (or layer) QL, and a light source LS.

The light source unit LU is disposed below the optical sheet OP. Theplate GL has a front surface GL-U that faces the display unit DP and arear surface GL-B opposite to the front surface GL-U. The front surfaceGL-U of the plate GL may be a surface on which the light scatteringsection FL is disposed, and the rear surface GL-B of the plate GL may bea surface on which the light source LS is disposed.

The light scattering section FL is disposed on the front surface GL-U ofthe plate GL. The light scattering section FL may disperse lightprovided from the light source LS, thereby preventing a partialconcentration of light. In an exemplary embodiment, the light scatteringsection FL may be formed by depositing a material, which includes atleast one material selected from polyester and polycarbonate, on thefront surface GL-U of the plate GL.

The light controlling section QL may be disposed on the light scatteringsection FL. The light controlling section QL may change a wavelength oflight provided from the light source LS. In an exemplary embodiment, thelight controlling section QL may include a plurality of quantum dots QD1and QD2.

The quantum dots QD1 and QD2 may include at least one material selectedfrom II-VI group compounds, III-V group compounds, IV-VI groupcompounds, IV group elements, IV group compounds, and a combinationthereof.

The II-VI group compounds may include a binary compound selected fromthe group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe,HgTe, MgSe, MgS, and a combination, (e.g., a mixture) thereof; a ternarycompound selected from the group consisting of AgInS, CuInS, CdSeS,CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS,CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe,MgZnS and a combination thereof, and a quaternary compound selected fromthe group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS,CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and a combinationthereof.

The III-V group compounds may include a binary compound selected fromthe group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN,InP, InAs, InSb and a combination thereof; a ternary compound selectedfrom the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP,AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb,GaAlNP and a combination thereof and a quaternary compound selected fromthe group consisting of GaAlNAs, GaAlNSb, GaAl, GaAlPSb, GaInNP,GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs,InAlPSb and a combination thereof.

The IV-VI group compounds may include a binary compound selected fromthe group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe and acombination thereof a ternary compound selected from the groupconsisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe,SnPbTe and a combination thereof; and a quaternary compound selectedfrom the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe and acombination thereof. The IV group elements may be selected from thegroup consisting of Si, Ge, and a combination thereof. The IV groupcompounds may include a binary compound selected from the groupconsisting of SiC, SiGe and a combination thereof.

In an exemplary embodiment, one of the binary, ternary, and quaternarycompounds may be present at a uniform concentration in a particle, ormay be present to have divided states at partially differentconcentrations in a same particle. In an exemplary embodiment, thequantum dots QD1 and QD2 may have a core/shell structure in which onequantum dot surrounds another quantum. An interface between the core andthe shell may have a concentration gradient such that concentration ofan element present in the shell decreases as approaching a center of thecore.

In an exemplary embodiment, the quantum dots QD1 and QD2 may have acore-shell structure in which a shell encloses a core includingnano-crystal described above. The shell of the quantum dots QD1 and Q2may serve as a protective layer which prevents chemical degeneration ofthe core to thereby maintain semiconductor characteristics and/or as acharging layer which provides the quantum dot with electrophoresisproperties. The shell may be a single layer or a multiple layer. Aninterface between the core and the shell may have a concentrationgradient such that concentration of an element present in the shelldecreases as approaching a center of the core. The shell of the quantumdot may be, for example, metal oxide, non-metal oxide, a semiconductorcompound, or a combination thereof.

The metal oxide or non-metal oxide may be a binary compound such asSiO₂, Al₂O₃, TiO₂, ZnO, MnO, Mn₂O₃, Mn₃O₄, CuO, FeO, Fe₂O₃, Fe₃O₄, COO,Co₃O₄, and NiO, or a ternary compound such as MgAl₂O₄, CoFe₂O₄, NiFe₂O₄,or CoMn₂O₄, but the invention is not limited thereto.

The semiconductor compound may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe,ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb,AlAs, AlP, AlSb, or a combination thereof, but the invention is notlimited thereto.

The quantum dots QD1 and QD2 may have a full width of half maximum(“FWHM”) of a light emitting wavelength spectrum, which FWHM fallswithin a range of about 45 nanometers (nm) or less, e.g. about 40 nm orless, or about 30 nm or less, and color purity and/or color reproductionmay improve in this range. In addition, light released through suchquantum dot may be emitted in all directions, which may result in animprovement in wide viewing angle.

The quantum dots QD1 and QD2 may have a shape generally used in the art,but the invention is not limited thereto. In one exemplary embodiment,for example, the quantum dots QD1 and QD2 may have a shape of sphere,pyramid, multi-arm, cubic nano-particle, nano-tube, nano-wire,nano-fiber, or nano-plate particle.

The quantum dots QD1 and QD2 may adjust a color of light emitted basedon a particle size thereof, and thus may have various luminous colorssuch as blue, red, and green.

The light source LS includes a light emitting element LED and leadframes LF1 and LF2. The light emitting element LED may emit light inresponse to voltage provided from a circuit board (not shown). The lightemitting element LED may have a structure in which an n-typesemiconductor layer, an active layer, and a p-type semiconductor layerare sequentially stacked one on another, such that when a drivingvoltage is applied, electrons and holes may migrate and recombine witheach other to generate light.

The lead frames LF1 and LF2 may be electrically connected to the lightemitting element LED, thereby providing the light emitting element LEDwith voltage provided from a circuit board (not shown). In an exemplaryembodiment, the light emitting element LED may provide a blue light.

The lead frames LF1 and LF2 may be coupled through conductive pastes PSto the rear surface GL-B of the plate GL. The conductive pastes PS mayinclude a conductive material. In such an embodiment, voltage providedfrom a circuit board (not shown) may be provided to the light emittingelement LED through the conductive pastes PS and the lead frames LF1 andLF2.

In an exemplary embodiment, light provided from the light emittingelement LED may pass through the plate GL, and then may be provided tothe display unit DP through the light scattering section FL and thelight controlling section QL. In such an embodiment, the quantum dotsQD1 and QD2 may convert a blue light L3 provided from the light emittingelement LED into a green light L1 or a red light L2, or alternativelythe blue light L3 may be directly provided to the display unit DP.Therefore, the display unit DP may be provided with a white lightproduced from a mixture of the green light L1, the red light L2, and theblue light L3.

Referring back to FIG. 1, the accommodation member HWM may be disposedbelow the light source unit LU, and may accommodate the display unit DP,the optical sheet OP, and the light source unit LU. The accommodationmember HWM may cover the display unit DP to expose a top surface of thedisplay unit DP. In one exemplary embodiment, for example, theaccommodation member HWM may cover lateral and bottom surfaces of thedisplay unit DP and expose an entire top surface of the display unit DP.Alternatively, the accommodation member HWM may cover a portion of thetop surface of the display unit DP and also cover the lateral and bottomsurfaces of the display unit DP, but the invention is not limitedthereto.

FIG. 4A illustrates a plan view showing a light source unit according toan exemplary embodiment of the invention. FIG. 4B illustrates anenlarged plan view showing a light source unit according to an exemplaryembodiment of the invention. FIG. 4C illustrates a cross-sectional viewtaken along line I-I′ of FIG. 4B. In FIGS. 4A to 4C, the same or likecomponents as those of FIGS. 1 to 3 are allocated the same or likereference symbols thereto, and any repetitive detailed descriptionthereof will be omitted or simplified.

Referring to FIG. 4A, an exemplary embodiment of the light source LSaccording to the invention is disposed on the rear surface GL-B of theplate GL. The light source LS may be provided in plural, and theplurality of light sources LS may be arranged in a matrix shape alongthe first and second directions DR1 and DR2 on the rear surface GL-B ofthe plate GL. The light sources LS are disposed spaced apart from eachother in the first and second directions DR1 and DR2.

Referring to FIGS. 4B and 4C, in an exemplary embodiment, the plate GLmay include a base layer G-BS, conductive lines G-CL, and a windowdielectric layer G-IL.

The base layer G-BS has a top surface G-U, on which the light scatteringsection FL is disposed, and a bottom surface G-B opposite to the topsurface G-U. The bottom surface G-B may be defined as the rear surface(see GL-B of FIG. 3) of the plate GL. The base layer G-BS may include aglass.

The conductive lines G-CL are disposed on the bottom surface G-B of thebase layer G-BS. The conductive lines G-CL may be connected to a circuitboard (not shown). The conductive lines G-CL may be connected tocorresponding lead frames LF1 and LF2 and may provide the light emittingelement LED with voltage provided from the circuit board.

In an exemplary embodiment, the base layer G-BS includes a line grooveG-H. The line groove G-H may be formed when the bottom surface G-B ofthe base layer G-BS is patterned along a thickness direction of theplate GL, or along the third direction DR3. The conductive lines G-CLmay be disposed along the line groove G-H. Although FIG. 4C shows anexemplary embodiment in which the conductive lines G-CL are disposed inthe line groove G-H to constitute a same planar surface with the bottomsurface G-B of the base layer G-BS, the conductive lines G-CL may have asmaller thickness than that of the line groove G-H and thus may bemounted within the line groove G-H or may have a larger thickness thanthat of the line groove G-H and thus may protrude outwardly from thebottom surface G-B of the base layer G-.

The window dielectric layer G-IL covers the bottom surface G-B of thebase layer G-BS. Contact holes CNT that expose at least portions of theconductive lines G-CL may be defined through the window dielectric layerG-IL. The window dielectric layer G-IL may include an inorganicmaterial. In one exemplary embodiment, for example, the windowdielectric layer G-IL may include at least one material selected fromsilicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride(SiON).

In an exemplary embodiment, the conductive pastes PS may overlapcorresponding contact holes CNT. The conductive pastes PS are connectedthrough the contact holes CNT to the conductive lines G-CL. Therefore,voltage provided from a circuit board (not shown) may be transferredfrom the conductive lines G-CL to the light emitting element LED throughthe conductive pastes PS and the lead frames LF1 and LF2.

In an exemplary embodiment, light generated from the light source LS isprovided through a light emitting surface L-U to the rear surface GL-Bof the plate GL. The light emitting surface L-U of the light source LSis disposed on the rear surface GL-B of the plate GL. In one exemplaryembodiment, for example, the light emitting surface L-U of the lightsource LS is disposed on the window dielectric layer G-IL and mayprovide the display unit DP with light.

According to exemplary embodiments of the invention, the light source LSis disposed to contact the rear surface GL-B of the plate GL without aninterval between the light source LS and the plate GL, such that theelectronic apparatus EA may decrease in size. In such an embodiment, thelight scattering section FL and the light controlling section QL areincluded which are disposed on the front surface GL-U of the plate GL,such that the electronic apparatus EA may increase in color purity andoptical efficiency.

FIG. 5A illustrates a plan view showing a light source unit according toan exemplary embodiment of the invention. FIG. 5B illustrates across-sectional view taken along line II-IF of FIG. 5A. In FIGS. 5A and5B, the same or like components to those of FIGS. 1 to 4C are allocatedthe same or like reference symbols thereto, and any repetitive detaileddescription thereof will be omitted. For convenience of illustration, adotted line is used to illustrate the light source LS disposed on therear surface (see GL-B of FIG. 3) of the plate GL.

Referring to FIGS. 5A and 5B, in an exemplary embodiment, a lightscattering section FL-1 includes a plurality of scattering patterns FP1,FP2, and FP3. The scattering patterns FP1, FP2, and FP3, when viewed ina plan view in the third direction DR3, may be disposed to overlapcorresponding light sources LS, respectively. The scattering patternsFP1, FP2, and FP3 are spaced apart from each other when viewed in theplan view.

A light controlling section QL-1 includes a plurality of controllingpatterns QP1, QP2, and QP3. The controlling patterns QP1, QP2, and QP3,when viewed in the plan, may be disposed to overlap corresponding lightsource LS, respectively. Therefore, the controlling patterns QP1, QP2,and QP3 may respectively overlap the scattering patterns FP1, FP2, andFP3. In one exemplary embodiment, for example, a first scatteringpattern FP1 overlaps a first controlling pattern QP1, and a secondscattering pattern FP2 overlaps a second controlling pattern QP2. Insuch an embodiment, a third scattering pattern FP3 may be disposedoverlapping a third controlling pattern QP3. The controlling patternsQP1, QP2, and QP3 are spaced apart from each other when viewed in theplan view.

FIG. 5A shows an exemplary embodiment with three scattering patternsFP1, FP2, and FP3 arranged in the first direction DR1 and threecontrolling patterns QP1, QP2, and QP3 arranged in the first directionDR1.

Light provided from a light source LS is irradiated to the front surfaceGL-U of the plate GL. In such an embodiment, light irradiated from onelight source LS to the front surface GL-U of the plate GL has a firstwidth T1, or a maximum width in the first direction DR1.

The second scattering pattern FP2 and the second controlling pattern QP2that are disposed on or corresponding to the light source LS has asecond width T2 in the first direction DR1.

In an exemplary embodiment, the second width T2 may be greater than thefirst width T1. FIG. 5B shows an exemplary embodiment where the secondscattering pattern FP2 and the second controlling pattern QP2 have asame width as each other or the second width T2, but not being limitedthereto. Alternatively, the second scattering pattern FP2 and the secondcontrolling pattern QP2 may have different widths from each other aslong as each of the second scattering pattern FP2 and the secondcontrolling pattern QP2 has a width greater than the first width T1 oflight irradiated to the front surface GL-U of the plate GL.

FIG. 6 illustrates a cross-sectional view showing a light source unitaccording to an exemplary embodiment of the invention. In FIG. 6, thesame or like components to those of FIGS. 1 to 4C are allocated the sameor like reference symbols thereto, and any repetitive detaileddescription thereof will be omitted.

In an exemplary embodiment, as shown in FIG. 6, a light source unit LU-1may include a plate GL, a light scattering section FL, a lightcontrolling section QL, and a light source LS. In such an embodiment,the light source unit LU-1 may further include a light reflectingsection RL. The plate GL, the light scattering section FL, the lightcontrolling section QL, and the light source LS of the light source unitLU-1 may be substantially the same as the plate GL, the light scatteringsection FL, the light controlling section QL, and the light source LS ofthe light source unit LU described above with reference to FIG. 3.

In an exemplary embodiment, the light reflecting section RL may bedisposed spaced apart from the rear surface GL-B of the plate GL acrossthe light source LS. The light reflecting section RL may be disposedbelow the light source LS, and may serve to reflect a light L4, which isleaked from the plate GL, to travel toward the light controlling sectionQL. The light reflecting section RL may not be limited in material aslong as the material is capable of reflecting light, and may be providedas a single layer or a multiple layer.

According to an exemplary embodiment, the light reflecting section RL isincluded to cause the leaked light L4 to travel toward the lightcontrolling section QL, such that the light source unit LU-1 mayincrease in optical efficiency.

FIG. 7 illustrates a cross-sectional view showing a light source unitaccording to an exemplary embodiment of the invention. In FIG. 7, thesame or like components to those of FIGS. 1 to 4C are allocated the sameor like reference symbols thereto, and any repetitive detaileddescription thereof will be omitted.

In an exemplary embodiment, as shown in FIG. 7, a light source unit LU-2may include a plate GL-2, a light scattering section FL, a lightcontrolling section QL, and a light source LS. The scattering sectionFL, the light controlling section QL, and the light source LS of thelight source unit LU-2 may be substantially the same as the lightscattering section FL, the light controlling section QL, and the lightsource LS of the light source unit LU described above with reference toFIG. 4C.

In an exemplary embodiment, the plate GL-2 may include a base layerG-B52, conductive lines G-CL2, and a window dielectric layer G-IL2.

In such an embodiment, the base layer G-BS2 includes a top surface G-Uon which the light scattering section FL is disposed and a bottomsurface G-B opposite to the top surface G-U. The bottom surface G-B maybe defined as a rear surface (see GL-B of FIG. 3) of the plate GL-2. Thebase layer G-B52 may include a glass.

The conductive lines G-CL2 are disposed on the bottom surface G-B of thebase layer G-BS2. In an exemplary embodiment, as shown in FIG. 7, theconductive lines G-CL2 are disposed directly on the bottom surface G-Bof the base layer G-BS2.

One of the conductive lines G-CL2 that is connected to the first leadframe LF1 is disposed spaced apart from other one of the conductivelines G-CL2 that is connected to the second lead frame LF2.

The window dielectric layer G-IL2 covers the conductive lines G-CL2 andthe bottom surface G-B of the base layer G-BS2. The window dielectriclayer G-IL2 may be disposed on in a space between the conductive linesG-CL2 connected to the lead frames LF1 and LF2 different from eachother.

Contact holes CNT that expose at least portions of the conductive linesG-CL2 are defined through the window dielectric layer G-IL2. Theconductive pastes PS are connected through the contact holes CNT to theconductive lines G-CL2.

According to an exemplary embodiment, the conductive lines G-CL2 aredisposed or formed on the base layer G-BS2 without separately performinga patterning process on the base layer G-BS2, such that the light sourceunit LU-2 may decrease in manufacturing cost and time.

FIGS. 8A to 81 illustrate cross-sectional views showing a method offabricating an electronic apparatus according to an exemplary embodimentof the invention. In FIGS. 8A to 81, the same or like components tothose of FIGS. 1 to 4C are allocated the same or similar referencesymbols thereto, and any repetitive detailed description thereof will beomitted.

Referring to FIGS. 8A to 8C, an exemplary embodiment of a method offabricating a light source unit includes providing a preliminary plate.

The providing of the preliminary plate may include preparing a baselayer G-BSA, forming a light scattering section FL on the base layerG-BSA, and forming a light controlling section QL on the lightscattering section FL. The base layer G-BSA has a top surface G-U and abottom surface G-B opposite to each other. The light scattering sectionFL is deposited on the top surface G-U of the base layer G-BSA.Afterwards, the light controlling section QL including quantum dots QD1and QD2 is deposited on the light scattering section FL. Therefore, thepreliminary plate may be formed as shown in FIG. 8C.

FIGS. 8A to 8C show an exemplary embodiment where the light scatteringsection FL and the light controlling section QL are entirely depositedon the top surface G-U of the base layer G-BSA, but not being limitedthereto. Alternatively, at least one mask may be separately used to formthe light scattering section FL that includes scattering patterns (seeFP1, FP2, and FP3 of FIG. 5A) spaced apart from each other and also toform the light controlling section QL that includes controlling patterns(see QP1, QP2, and QP3 of FIG. 5A) deposited on corresponding scatteringpatterns (see FP1, FP2, and FP3 of FIG. 5A), respectively.

In an exemplary embodiment, referring to FIG. 8D, the method offabricating a light source unit includes forming a line groove G-H.

The line groove G-H may be formed when the bottom surface G-B of thebase layer G-BS is patterned along a thickness direction of the baselayer G-BS.

Thereafter, referring to FIGS. 8E and 8F, the method of fabricating alight source unit may include forming conductive lines G-CL.

The conductive lines G-CL may be formed by coating a conductive materialG-CLA on the bottom surface G-B of the base layer G-BS on which the linegroove G-H is formed, and then patterning the conductive material G-CLAto externally expose the bottom surface G-B.

Thereafter, the formation of a window dielectric layer G-IL may beperformed. The window dielectric layer G-IL may be formed by coating aninorganic material on the bottom surface G-B of the base layer G-BS, andthen by forming contact holes CNT through the inorganic material toexpose portions of the conductive lines G-CL. The preliminary plate ofFIG. 8C may thus be formed into a plate GL that includes the base layerG-BS, the conductive lines G-CL, and the window dielectric layer G-IL.

In such an embodiment, referring to FIG. 8G, the method of fabricating alight source unit may include forming conductive pastes PS.

The conductive pastes PS may be formed by coating a paste that includesa conductive material to overlap the contact holes CNT.

In such an embodiment, referring to FIG. 8H, the method of fabricating alight source unit may include providing a light source LS.

The light source LS is disposed directly on the window dielectric layerG-IL. Lead frames LF1 and LF2 of the light source LS may protrude from alight emitting element LED and may overlap the conductive pastes PS.

In such an embodiment, referring to FIG. 8I, the method of fabricating alight source unit may further include heating the conductive pastes PSand then solidifying the conductive pastes PS that are melted or in amolten state.

The lead frames LF1 and LF2 may be introduced into the conductive pastesPS in a heated state, and the melted conductive pastes PS may besolidified to allow the lead frames LF1 and LF2 to have electricalconnection with the conductive lines G-CL that are exposed from thecontact holes CNT.

According to exemplary embodiments of the invention, the light source LSis disposed to contact the bottom surface G-B of the base layer G-BSwithout an interval between the light source LS and the plate GL, suchthat it may be possible to provide a small-sized electrode apparatus(see EA of FIG. 1). In such embodiments, the light scattering section FLand the light controlling section QL are included to be disposed on afront surface GL-U of the plate GL, or on the top surface G-U of thebase layer G-BS, such that the electronic apparatus EA may have improvedcolor purity and optical efficiency.

The invention should not be construed as being limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this disclosure will be thorough and complete and willfully convey the concept of the invention to those skilled in the art.

While the invention has been particularly shown and described withreference to exemplary embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit or scopeof the invention as defined by the following claims.

What is claimed is:
 1. A light source unit, comprising: a plateincluding a front surface and a rear surface opposite to the frontsurface; a light scattering section on the front surface of the plate; alight controlling section on the light scattering section, wherein thelight controlling section includes a plurality of quantum dots; a lightsource on the rear surface of the plate, wherein the light sourceincludes a light emitting element which generates light, a lightemitting surface from which the light is emitted, and a plurality oflead frames connected to the light emitting element, wherein the lightsource provides light from the rear surface of the plate toward thelight controlling section, and wherein the light emitting surface of thelight source is in contact with the rear surface of the plate.
 2. Thelight source unit of claim 1, wherein the plate includes: a base layerincluding a top surface, on which the light scattering section isdisposed, and a bottom surface opposite to the top surface; a pluralityof conductive lines on the bottom surface of the base layer; and awindow dielectric layer which covers the bottom surface of the baselayer, wherein a plurality of contact holes is defined through thewindow dielectric layer to expose portions of the conductive lines,wherein each of the lead frames is connected to a corresponding one ofthe conductive lines.
 3. The light source unit of claim 2, furthercomprising: a plurality of conductive pastes on the window dielectriclayer, wherein the conductive pastes overlap the contact holes,respectively, wherein the lead frames are connected to the conductivelines through the conductive pastes.
 4. The light source unit of claim2, wherein the base layer includes a line groove patterned on the bottomsurface of the base layer in a thickness direction of the plate, and theconductive lines are disposed in the line groove.
 5. The light sourceunit of claim 1, wherein the light source is provided in plural, thelight scattering section includes a plurality of scattering patternswhich overlaps the plurality of light sources, respectively, when viewedin a plan view, and the light controlling section further includes aplurality of controlling patterns which overlap the scattering patterns,respectively, when viewed in the plan view.
 6. The light source unit ofclaim 5, wherein a width of each of the controlling patterns is greaterthan a maximum width of light irradiated to the front surface of theplate from a corresponding one of the light sources.
 7. The light sourceunit of claim 1, wherein the light provided from the light source towardthe light controlling section is a blue light.
 8. The light source unitof claim 7, wherein the quantum dots of the light controlling sectionconvert the light provided from the light source into one of a red lightand a green light.
 9. The light source unit of claim 1, furthercomprising: a light reflecting section spaced apart from the rearsurface of the plate over the light source.
 10. An electronic apparatus,comprising: a light source unit including: a plate including a frontsurface and a rear surface opposite to the front surface; a lightscattering section on the front surface of the plate; a lightcontrolling section on the light scattering section; and a light sourceon the rear surface of the plate, wherein the light controlling sectionincludes a plurality of quantum dots; a display unit on the light sourceunit, wherein the display unit includes a first substrate, a secondsubstrate opposite to the first substrate, and a liquid crystal layerbetween the first substrate and the second substrate; and an opticalsheet between the display unit and the light source unit, wherein thelight source provides the display unit with light and contacts the rearsurface of the plate.
 11. The electronic apparatus of claim 10, whereinthe plate includes: a base layer including a top surface, on which thelight scattering section is disposed, and a bottom surface opposite tothe top surface; a plurality of conductive lines on the bottom surfaceof the base layer; and a window dielectric layer which covers the bottomsurface of the base layer, wherein a plurality of contact holes isdefined through the window dielectric layer to expose portions of theconductive lines.
 12. The electronic apparatus of claim 11, wherein thelight source includes a light emitting element which generates light,and a plurality of lead frames connected to the light emitting element,wherein each of the lead frames is connected to a corresponding one ofthe conductive lines.
 13. The electronic apparatus of claim 12, whereinthe light source unit further includes a plurality of conductive pasteson the window dielectric layer, wherein the conductive pastes overlapthe contact holes, respectively, and the lead frames are connected tothe conductive lines through the conductive pastes.
 14. The electronicapparatus of claim 11, wherein the base layer includes a line groovepatterned on the bottom surface of the base layer in a thicknessdirection of the plate, and the conductive lines are disposed in theline groove.
 15. The electronic apparatus of claim 10, wherein the lightsource is provided in plural, the light scattering section includes aplurality of scattering patterns which overlap a plurality of lightsources, respectively, when viewed in a plan view, and the lightcontrolling section further includes a plurality of controlling patternswhich overlaps the scattering patterns, respectively, when viewed in theplan view.
 16. The electronic apparatus of claim 15, wherein a width ofeach of the controlling patterns is greater than a maximum width oflight irradiated to the front surface of the plate from a correspondingone of the light sources.
 17. The electronic apparatus of claim 10,wherein the first substrate includes a first base substrate, atransistor on the first base substrate, a first electrode connected tothe transistor, a color filter layer between the transistor and thefirst electrode, and a first polarizing layer below the first basesubstrate, and the second substrate includes a second base substrate, asecond electrode on the second base substrate, and a second polarizinglayer on the second base substrate.
 18. The electronic apparatus ofclaim 10, wherein the optical sheet includes at least one sheet selectedfrom a diffusion sheet, a prism sheet, and a brightness enhancementsheet.
 19. A method of fabricating a light source unit, the methodcomprising: providing a preliminary plate which includes a base layerincluding a top surface and a bottom surface opposite to each other, alight scattering section on the top surface of the base layer, and alight controlling section on the light scattering section; patterningthe bottom surface of the base layer to form a line groove, wherein thebottom surface is patterned in a thickness direction of the base layer;providing a plurality of conductive lines in the line groove; providinga window dielectric layer on the conductive lines, and forming aplurality of contact holes through the window dielectric layer to exposeat least portions of the conductive lines; providing a plurality ofconductive pastes which overlaps the contact holes, respectively; andproviding a light source connected to the conductive lines through theconductive pastes, wherein the light source is in contact with thewindow dielectric layer.
 20. The method of claim 19, further comprising:heating the conductive pastes; and solidifying the conductive pasteswhich are in a molten state.